Reflow Oven- T960
The T960 Reflow Oven is a high-performance, semi-automatic reflow soldering system designed for small to medium-scale SMT production. Utilizing infrared and hot air circulation technology, it ensures uniform heat distribution, precise temperature control, and high-efficiency soldering for PCBs. Its compact design, user-friendly interface, and reliable performance make it an ideal choice for SMT assembly lines, prototyping, and low-volume production.
Product Features
- Advanced Infrared & Hot Air Heating – Ensures even and consistent soldering.
- High-Precision Temperature Control – Multi-zone temperature control system for optimal reflow profiles.
- Automated Operation – Reduces manual intervention, improving efficiency and repeatability.
- Multiple Soldering Modes – Supports lead-free and traditional soldering processes.
- User-Friendly Interface – LCD touchscreen display for easy operation and real-time monitoring.
- Energy Efficient – Low power consumption while maintaining high productivity.
- Compact & Durable Design – Space-saving structure suitable for various production environments.
Product Applications
- PCB Assembly & Manufacturing.
- SMT Production Lines.
- LED Industry.
- Automotive Electronics.
- Consumer Electronics Manufacturing.
- Prototyping & R&D Labs.